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  1. NEW Mead Precision Slide Rule in original retail packaging - ISRM Fund Raiser
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  6. Area Array Packaging Materials: Adhesives, Pastes, and Lead-Free, Ken Gilleo, Go
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  16. Electronic Packaging of High Speed Circuitry Stephen G. Konsowski 9780070359703
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  17. H-Point: The Fundamentals of Car Design & Packaging
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  18. Area Array Packaging Processes for Bga, Flip Chip, and Csp by Ken Gilleo...
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  19. Practical Guide to the Packaging of Electronics by Ali Jamnia (2008, Hardcover)
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  21. Materials for Electronic Packaging
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  29. Handbook of Frozen Food Processing and Packaging (Contemporary Food Engineering)
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